拨码开关，DIP开关

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详细说明：

FEATURES

     ●End stackable for standard 0.1" integrated circuit pitch.
     ●Molded 0.3" integrated circuit packing outline allowing automatic insertion.
     ●Smaller size makes better heat convection during PC board reflow wave soldering.
     ●Top tape sealed to withstand wave soldering, board washing.
     ●All plastics are UL 94V-0 grade fire retardant.
     ●Twin contacts designed to ensure stable contact.
     ●Gold plated contact to ensure low contact resistance and Tin plated terminal to prevent
       contamination during soldering.